Wu Jingshen, Dean , Chair Professor

· Professor and Dean of the Institute of Systems Design and Intelligent Manufacturing.

· Engineering Materials and Reliability Research Specialist National high-level innovative talents

· National high-level innovative talents National high-level innovative talents

· National high-level innovative talents National high-level innovative talents


Research areas

Structural design and processing of polymer materials and polymer nanocomposites; fracture and toughening mechanism of engineering materials; dielectric properties of polymer composites in extreme environments; development of advanced electronic packaging materials, packaging structure design and failure mechanism analysis Study on dielectric properties of polymer composites in extreme environments; development of advanced electronic packaging materials, package structure design, failure mechanism analysis, etc.


Structural design and processing of polymer materials and polymer nanocomposites; fracture and toughening mechanism of engineering materials; dielectric properties of polymer composites in extreme environments; development of advanced electronic packaging materials, packaging structure design and failure mechanism analysis Study on dielectric properties of polymer composites in extreme environments; development of advanced electronic packaging materials, package structure design, failure mechanism analysis, etc.

Fred HAN , Assistant professor

· Professor and Dean of the Institute of Systems Design and Intelligent Manufacturing.

· Engineering Materials and Reliability Research Specialist National high-level innovative talents

· National high-level innovative talents National high-level innovative talents

· National high-level innovative talents National high-level innovative talents


Research areas

Structural design and processing of polymer materials and polymer nanocomposites; fracture and toughening mechanism of engineering materials; dielectric properties of polymer composites in extreme environments; development of advanced electronic packaging materials, packaging structure design and failure mechanism analysis Study on dielectric properties of polymer composites in extreme environments; development of advanced electronic packaging materials, package structure design, failure mechanism analysis, etc.


Structural design and processing of polymer materials and polymer nanocomposites; fracture and toughening mechanism of engineering materials; dielectric properties of polymer composites in extreme environments; development of advanced electronic packaging materials, packaging structure design and failure mechanism analysis Study on dielectric properties of polymer composites in extreme environments; development of advanced electronic packaging materials, package structure design, failure mechanism analysis, etc.

Wang Ke , Professor

· Professor and Dean of the Institute of Systems Design and Intelligent Manufacturing.

· Engineering Materials and Reliability Research Specialist National high-level innovative talents

· National high-level innovative talents National high-level innovative talents

· National high-level innovative talents National high-level innovative talents


Research areas

Structural design and processing of polymer materials and polymer nanocomposites; fracture and toughening mechanism of engineering materials; dielectric properties of polymer composites in extreme environments; development of advanced electronic packaging materials, packaging structure design and failure mechanism analysis Study on dielectric properties of polymer composites in extreme environments; development of advanced electronic packaging materials, package structure design, failure mechanism analysis, etc.


Structural design and processing of polymer materials and polymer nanocomposites; fracture and toughening mechanism of engineering materials; dielectric properties of polymer composites in extreme environments; development of advanced electronic packaging materials, packaging structure design and failure mechanism analysis Study on dielectric properties of polymer composites in extreme environments; development of advanced electronic packaging materials, package structure design, failure mechanism analysis, etc.

Wu Yuanqing, Assistant professor

· Professor and Dean of the Institute of Systems Design and Intelligent Manufacturing.

· Engineering Materials and Reliability Research Specialist National high-level innovative talents

· National high-level innovative talents National high-level innovative talents

· National high-level innovative talents National high-level innovative talents


Research areas

Structural design and processing of polymer materials and polymer nanocomposites; fracture and toughening mechanism of engineering materials; dielectric properties of polymer composites in extreme environments; development of advanced electronic packaging materials, packaging structure design and failure mechanism analysis Study on dielectric properties of polymer composites in extreme environments; development of advanced electronic packaging materials, package structure design, failure mechanism analysis, etc.


Structural design and processing of polymer materials and polymer nanocomposites; fracture and toughening mechanism of engineering materials; dielectric properties of polymer composites in extreme environments; development of advanced electronic packaging materials, packaging structure design and failure mechanism analysis Study on dielectric properties of polymer composites in extreme environments; development of advanced electronic packaging materials, package structure design, failure mechanism analysis, etc.

Hong xiaoping, Assistant Professor

Dr. Xiaoping Hong received bachelor degree from HKUST in 2009, and PhD from UC Berkeley in 2014, both in physics. Dr. Xiaoping Hong has rich experience in interdisciplinary research and engineering. He led the sensor research and development as a Senior Scientist at Honeywell in Silicon Valley. He joined DJI in 2016 as the Head of Optoelectronics Department and led the R&D and manufacturing of the optoelectronic modules and products. Dr. Xiaoping Hong’s research was published on several top journals. He was also granted multiple international patents.


Research areas

Sensor design and application for mobile robot

Novel optical imaging and machine vision

Sensor algorithms and system integration

LI Zexiang, Professor

· 2019:IEEE Robotics and Automation Award

· Outstanding Contribution Award, Aug. 2008. Division of Mechanical Engineering, National Natural Science Foundation of China.

· IEEE Fellow, Jan. 2008. For fundamental contributions to robotic manipulation, nonholonomic motion planning and workpiece localization.

· Instructor for the First- and Second-runner up teams, Robocon 2010.


Research areas

Robot manipulation; design and control of multifingered robotic hands; motion planning; real-time systems; and parallel robots.

Motion control; geometric methods of nonlinear control systems; geometric mechanics.

Machine tool control systems; computer-aided setups & dimensional inspections; precision machining.

XIONG Yi, Assistant Professor

· 2016, PhD scholarship, Aalto University

· 2013, Research Travel Grant, International Association for Vehicle System Dynamics (IAVSD)

· 2008, National Scholarship, Ministry of Education


Research areas

Mechanical Design: Applications of computational methods in product-material-process-performance design; design methodology and methods for complex engineering products

Intelligent products and manufacturing systems: Life-time sensing and iterative design of intelligent products; new hybrid manufacturing methods and equipment; adaptive process planning

XUE Ke , Research Assistant Professor

Prof. Xue obtained his bachelor degree in mechanical engineering from Harbin Institute of Technology in 2005 and Ph.D in mechanical engineering from the Hong Kong University of Science and Technology in 2010. After then, Dr. Xue has worked in industry for a long time and built-up extensive experience in designing and developing semiconductor packaging products.


Research areas

Reliability design and optimization of semiconductor packaging products Structural design and heat dissipation analysis of system-level packaging and high power devices

Advanced electronic packaging materials, process and reliability

Macro-microscopic modeling and simulation of mechanical behavior of composite materials

ZHOU Limin , Chair Professor

. Prof. Zhou’s major research interests include advanced composite materials and structures, smart materials and structures, nanomaterials and nanotechnology for energy storage and conversions, and structural health monitoring techniques. He has published more than 350 technical articles including over 250 SCI refereed journal papers, and received many awards including the Engineering Faculty Best Researcher Award in 1999 and the President’s Award for Outstanding Performance/Achievements in Research and Scholarly Activities in 2000.


Research areas

Nanomaterials and nanotechnology for sustainable energy conversion and storage

High performance polymer composites

Functional composites

Structure health monitoring

Wu Jingshen

Chair Professor

Fred HAN

Assistant professor

Wang Ke

Professor

Wu Yuanqing

Assistant professor

Wu Jingshen

Chair Professor

Fred HAN

Assistant professor

Fred HAN

Assistant professor

Fred HAN

Assistant professor

Fred HAN

Assistant professor

Fred HAN

Assistant professor

Wu Jingshen

Chair Professor

Fred HAN

Assistant professor

Wang Ke

Professor

Wu Yuanqing

Assistant professor

Wu Jingshen

Chair Professor

Fred HAN

Assistant professor

Fred HAN

Assistant professor

Fred HAN

Assistant professor

Fred HAN

Assistant professor

Fred HAN

Assistant professor